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TSL230RD, TSL230ARD, TSL230BRD
PROGRAMMABLE LIGHT-TO-FREQUENCY CONVERTERS
TAOS054P  OCTOBER 2007
9
The LUMENOLOGY r Company
r
r
Copyright E 2007, TAOS Inc.
www.taosinc.com
MECHANICAL DATA
This SOIC package consists of an integrated circuit mounted on a lead frame and encapsulated with an electrically
nonconductive clear plastic compound. The TSL230RD has a 10 ?/SPAN> 10 array of photodiodes with a total size of
0.96 mm by 0.96 mm. The photodiodes are 0.084 mm ?/SPAN> 0.084 mm in size and are positioned on 0.096 mm centers.
PACKAGE D
PLASTIC SMALL-OUTLINE
A
1.75
1.35
0.50
0.25
4.00
3.80
6.20
5.80
455
0.88 TYP TOP OF
SENSOR DIE
5.00
4.80
5.3
MAX
1.27
0.41
0.25
0.10
0.25
0.19
DETAIL A
PIN 1
6 y 1.27
0.510
0.330
8 y
j 2.8 TYP 
CLEAR WINDOW
2.12
 + 0.250
3.00 + 0.250
NOTE B
Pb
PIN 1
TOP VIEW
BOTTOM VIEW
SIDE VIEW
END VIEW
NOTES:  A.  All linear dimensions are in millimeters.
B.  The center of the 0.96-mm by 0.96-mm photo-active area is referenced to the upper left corner tip of the lead frame (Pin 1).
C.  Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D.  This drawing is subject to change without notice.
Figure 8. Package D  Plastic Small Outline IC Packaging Configuration
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